The use of new semiconductor technologies such as silicon carbide (SiC) and gallium nitride (GaN) enables significantly higher switching frequencies, allowing for more compact and efficient designs with improved response times and control accuracy. Wide bandgap (WBG) semiconductors, such as SiC and GaN, have superior electrical properties in terms of switching speed, voltage withstand capability, and losses, thereby enabling more efficient operation at higher temperatures. By increasing the switching frequency, the weight and size of passive components, such as capacitors, can be reduced, allowing for more compact designs. 

New circuit topologies and advances in manufacturing technology are leading to increasingly smaller power converters and placing high demands on thermal management and electrical layout, as high packing densities and shorter electrical traces are expected to reduce losses. The use of optimized heat sinks and insulated metal substrates (IMS) increases the reliability of power converters and improves heat dissipation. Advanced energy management functions enable dynamic adjustment of power consumption based on load requirements. 

At the same time, modularization is becoming increasingly important. Standardized assemblies and modular systems allow modules to be flexibly configured, scaled, and more easily maintained, which shortens development times and reduces costs.

This progress is complemented by increasingly intelligent systems with advanced diagnostic and monitoring functions, digital control technologies, and the integration of advanced safety and protection features. The diagnostic and monitoring functions enable preventive maintenance and ensure better fault detection, while digital control technologies allow the performance of the converters to be optimized via software updates. Protection functions against overcurrent, overheating, and overvoltage ensure increased reliability and a longer service life for the power converters. 

Despite technological advances, manufacturers of power converters continue to face challenges in the global supply chain. Shortages of key components—particularly power semiconductors, passive components, and control ICs—are leading to delays and rising costs. Modern wide-bandgap semiconductors such as SiC and GaN are particularly affected, as high demand and complex manufacturing processes limit their availability. To ensure supply, many companies are relying on strategies such as supplier diversification, regional manufacturing, and long-term partnerships.

Connectors with a small pitch are ideal for use in power converters; they require minimal space on the printed circuit board, thereby facilitating the design of particularly space-saving and high-power-density electronic modules. The 1.27 mm pitch of ept’s One27 product family represents an ideal balance between miniaturization, electrical performance, and mechanical stability.

The modular system of the One27 product group offers a wide range of options for customizing connection solutions. A wide selection of designs, heights, and pin counts allows for continuous horizontal PCB spacing from 8.0 to 20.00 mm—achieved through a contact overlap of 2.4 mm. In addition to parallel (horizontal) connections, 90° and 180° configurations are also possible, offering high flexibility in PCB placement. In addition, cable connections enable flexible assembly layout, compensation for tolerances, and the implementation of custom spacing. The cables are available in various lengths and insulation types—depending on mechanical or thermal requirements. Furthermore, special configurations, such as partial assemblies or trailing contacts, can be implemented to specifically address specific electrical or mechanical requirements.

The One27 product family is characterized by its high robustness, which is particularly important for automotive applications. Mechanically, the One27 product family impresses with its high vibration resistance and stability, which are essential for automotive use. Even under demanding conditions, the electrical connection remains reliable. In addition, the One27 product family features practical mechanical characteristics such as anti-rotation protection for correct mating, positioning pins for precise placement, and insertion chamfers that compensate for angular and axial misalignment during mating. These features enhance ease of assembly and ensure a secure, precise, and durable connection.
Furthermore, the choice of insulation material is critical for temperature resistance. LCP (Liquid Crystal Polymer) is ideally suited for operating temperatures ranging from -55°C to +125°C due to its UL 94 V-0 flammability rating and meets the high requirements of the automotive industry.

Another key advantage of the One27 product line is that it is developed and manufactured within the European Union, ensuring a reliable supply chain with short lead times. This regional manufacturing ensures the highest quality standards while also guaranteeing the timely availability of components—a critical factor for manufacturers that rely on quick response times.