EC.8: Overview

Key Facts Applications EC.8 Products Features Comparison with connectors Tolerances Developer's perspective FAQ

High-speed direct connector connections up to 28 Gbit/s

The EC.8's direct-connect design enables data transfer speeds of up to 28 Gbit/s.

EC8 Highspeed mit Pfeile.Produktseite

Features

Direct-attach connectors,
20 to 200 contacts,
28 Gbps data transfer rate, 3
- 2 A current-carrying capacity,
500 mating cycles,
packaged in tape & reel or tray, daughter
card thickness: 1.60 mm

Applications

Embedded
Industrial Automation
Datacom

EC.8: Overview

Key Facts Applications EC.8 Products Features Comparison with connectors Tolerances Developer's perspective FAQ

EC.8 - straight

EC.8, just 20p Part No. 408-52020-000-11

EC8 gerade 20pol ohne key Foto

Number of poles: 20, without encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging

Perpendicular

SMT

Direct Connector

High Density

High Speed

show more product details

EC.8, just 20p Part No. 408-52020-000-11 - Technical data

Basics

No. of Contacts	20
Termination Technology	SMT
Operating Temperature Range	-40°F to +125°F

Material

Insulator Material	LCP, UL 94 V-0
CTI value IEC 60112	200
Contact Material	copper alloy
Plating	Au over PdNi over Ni
Termination area	Sn over Ni

Mechanical

Pitch	0.8 mm
Mating Force per Pin	≤ 0.635 N
Separating Force per Pin	≥ 0.06 N
Durability IEC 60512-9-1	500 insertion cycles
Coplanarity	≤ 0.1 mm
Vibration, sinusoidal IEC 60512-6-4	10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5	≤ 1 µs
Shock, semi-sinusoidal IEC 60512-6-3	50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5	≤ 1 µs

Electrical

Operational Current IEC 60512-5-2	1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins)
Contact Resistance IEC 60512-2-1	≤ 15 mΩ
Clearance and Creepage	0.25 mm
Insulation Resistance IEC 60512-3-1	≥ 1 GΩ
Test Voltage IEC 60512-4-1	1100 VDC
Data Transfer Rate	28 Gbit/s

Processing

Soldering Temperature JEDEC J-STD-020E	20–40 seconds at 260°C
MSL JEDEC J-STD-020E	1
Assembly	Pick and Place

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Derating Diagram

EC.8 exactly 40p Part No. 408-52040-000-11

EC8 gerade 40pol ohne key Foto

Number of poles: 40, without encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging

Perpendicular

SMT

Direct Connector

High Density

High Speed

show more product details

EC.8 exactly 40p Part No. 408-52040-000-11 - Technical data

Basics

No. of Contacts	40
Termination Technology	SMT
Operating Temperature Range	-40°F to +125°F

Material

Insulator Material	LCP, UL 94 V-0
CTI value IEC 60112	200
Contact Material	copper alloy
Plating	Au over PdNi over Ni
Termination area	Sn over Ni

Mechanical

Pitch	0.8 mm
Mating Force per Pin	≤ 0.635 N
Separating Force per Pin	≥ 0.06 N
Durability IEC 60512-9-1	500 insertion cycles
Coplanarity	≤ 0.1 mm
Vibration, sinusoidal IEC 60512-6-4	10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5	≤ 1 µs
Shock, semi-sinusoidal IEC 60512-6-3	50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5	≤ 1 µs

Electrical

Operational Current IEC 60512-5-2	1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins)
Contact Resistance IEC 60512-2-1	≤ 15 mΩ
Clearance and Creepage	0.25 mm
Insulation Resistance IEC 60512-3-1	≥ 1 GΩ
Test Voltage IEC 60512-4-1	1100 VDC
Data Transfer Rate	28 Gbit/s

Processing

Soldering Temperature JEDEC J-STD-020E	20–40 seconds at 260°C
MSL JEDEC J-STD-020E	1
Assembly	Pick and Place

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Derating Diagram

EC.8, exactly 60p Part No. 408-52060-000-11

EC8 gerade 60pol ohne key Foto

Number of poles: 60, without encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging

Perpendicular

SMT

Direct Connector

High Density

High Speed

show more product details

EC.8, exactly 60p Part No. 408-52060-000-11 - Technical data

Basics

No. of Contacts	60
Termination Technology	SMT
Operating Temperature Range	-40°F to +125°F

Material

Insulator Material	LCP, UL 94 V-0
CTI value IEC 60112	200
Contact Material	copper alloy
Plating	Au over PdNi over Ni
Termination area	Sn over Ni

Mechanical

Pitch	0.8 mm
Mating Force per Pin	≤ 0.635 N
Separating Force per Pin	≥ 0.06 N
Durability IEC 60512-9-1	500 insertion cycles
Coplanarity	≤ 0.1 mm
Vibration, sinusoidal IEC 60512-6-4	10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5	≤ 1 µs
Shock, semi-sinusoidal IEC 60512-6-3	50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5	≤ 1 µs

Electrical

Operational Current IEC 60512-5-2	1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins)
Contact Resistance IEC 60512-2-1	≤ 15 mΩ
Clearance and Creepage	0.25 mm
Insulation Resistance IEC 60512-3-1	≥ 1 GΩ
Test Voltage IEC 60512-4-1	1100 VDC
Data Transfer Rate	28 Gbit/s

Processing

Soldering Temperature JEDEC J-STD-020E	20–40 seconds at 260°C
MSL JEDEC J-STD-020E	1
Assembly	Pick and Place

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Derating Diagram

EC.8, exactly 60p Part No. 408-52060-100-11

EC8 gerade 60pol mit key Foto

Number of poles: 60, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging

Perpendicular

SMT

Direct Connector

High Density

High Speed

show more product details

EC.8, exactly 60p Part No. 408-52060-100-11 - Technical data

Basics

No. of Contacts	60
Termination Technology	SMT
Operating Temperature Range	-40°F to +125°F

Material

Insulator Material	LCP, UL 94 V-0
CTI value IEC 60112	200
Contact Material	copper alloy
Plating	Au over PdNi over Ni
Termination area	Sn over Ni

Mechanical

Pitch	0.8 mm
Mating Force per Pin	≤ 0.635 N
Separating Force per Pin	≥ 0.06 N
Durability IEC 60512-9-1	500 insertion cycles
Coplanarity	≤ 0.1 mm
Vibration, sinusoidal IEC 60512-6-4	10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5	≤ 1 µs
Shock, semi-sinusoidal IEC 60512-6-3	50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5	≤ 1 µs

Electrical

Operational Current IEC 60512-5-2	1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins)
Contact Resistance IEC 60512-2-1	≤ 15 mΩ
Clearance and Creepage	0.25 mm
Insulation Resistance IEC 60512-3-1	≥ 1 GΩ
Test Voltage IEC 60512-4-1	1100 VDC
Data Transfer Rate	28 Gbit/s

Processing

Soldering Temperature JEDEC J-STD-020E	20–40 seconds at 260°C
MSL JEDEC J-STD-020E	1
Assembly	Pick and Place

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Derating Diagram

EC.8 exactly 80p Part No. 408-52080-100-11

EC8 gerade 80pol mit key Foto

Number of poles: 80, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging

Perpendicular

SMT

Direct Connector

High Density

High Speed

show more product details

EC.8 exactly 80p Part No. 408-52080-100-11 - Technical data

Basics

No. of Contacts	80
Termination Technology	SMT
Operating Temperature Range	-40°F to +125°F

Material

Insulator Material	LCP, UL 94 V-0
CTI value IEC 60112	200
Contact Material	copper alloy
Plating	Au over PdNi over Ni
Termination area	Sn over Ni

Mechanical

Pitch	0.8 mm
Mating Force per Pin	≤ 0.635 N
Separating Force per Pin	≥ 0.06 N
Durability IEC 60512-9-1	500 insertion cycles
Coplanarity	≤ 0.1 mm
Vibration, sinusoidal IEC 60512-6-4	10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5	≤ 1 µs
Shock, semi-sinusoidal IEC 60512-6-3	50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5	≤ 1 µs

Electrical

Operational Current IEC 60512-5-2	1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins)
Contact Resistance IEC 60512-2-1	≤ 15 mΩ
Clearance and Creepage	0.25 mm
Insulation Resistance IEC 60512-3-1	≥ 1 GΩ
Test Voltage IEC 60512-4-1	1100 VDC
Data Transfer Rate	28 Gbit/s

Processing

Soldering Temperature JEDEC J-STD-020E	20–40 seconds at 260°C
MSL JEDEC J-STD-020E	1
Assembly	Pick and Place

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Derating Diagram

EC.8 exactly 100p Part No. 408-52100-100-11

EC8 gerade 100pol mit key Foto

Number of poles: 100, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging

Perpendicular

SMT

Direct Connector

High Density

High Speed

show more product details

EC.8 exactly 100p Part No. 408-52100-100-11 - Technical data

Basics

No. of Contacts	100
Termination Technology	SMT
Operating Temperature Range	-40°F to +125°F

Material

Insulator Material	LCP, UL 94 V-0
CTI value IEC 60112	200
Contact Material	copper alloy
Plating	Au over PdNi over Ni
Termination area	Sn over Ni

Mechanical

Pitch	0.8 mm
Mating Force per Pin	≤ 0.635 N
Separating Force per Pin	≥ 0.06 N
Durability IEC 60512-9-1	500 insertion cycles
Coplanarity	≤ 0.1 mm
Vibration, sinusoidal IEC 60512-6-4	10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5	≤ 1 µs
Shock, semi-sinusoidal IEC 60512-6-3	50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5	≤ 1 µs

Electrical

Operational Current IEC 60512-5-2	1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins)
Contact Resistance IEC 60512-2-1	≤ 15 mΩ
Clearance and Creepage	0.25 mm
Insulation Resistance IEC 60512-3-1	≥ 1 GΩ
Test Voltage IEC 60512-4-1	1100 VDC
Data Transfer Rate	28 Gbit/s

Processing

Soldering Temperature JEDEC J-STD-020E	20–40 seconds at 260°C
MSL JEDEC J-STD-020E	1
Assembly	Pick and Place

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Derating Diagram

EC.8 straight 120p Part No. 408-52120-100-11

EC8 gerade 120pol mit key Foto

Number of poles: 120, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging

Perpendicular

SMT

Direct Connector

High Density

High Speed

show more product details

EC.8 straight 120p Part No. 408-52120-100-11 - Technical data

Basics

No. of Contacts	120
Termination Technology	SMT
Operating Temperature Range	-40°F to +125°F

Material

Insulator Material	LCP, UL 94 V-0
CTI value IEC 60112	200
Contact Material	copper alloy
Plating	Au over PdNi over Ni
Termination area	Sn over Ni

Mechanical

Pitch	0.8 mm
Mating Force per Pin	≤ 0.635 N
Separating Force per Pin	≥ 0.06 N
Durability IEC 60512-9-1	500 insertion cycles
Coplanarity	≤ 0.1 mm
Vibration, sinusoidal IEC 60512-6-4	10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5	≤ 1 µs
Shock, semi-sinusoidal IEC 60512-6-3	50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5	≤ 1 µs

Electrical

Operational Current IEC 60512-5-2	1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins)
Contact Resistance IEC 60512-2-1	≤ 15 mΩ
Clearance and Creepage	0.25 mm
Insulation Resistance IEC 60512-3-1	≥ 1 GΩ
Test Voltage IEC 60512-4-1	1100 VDC
Data Transfer Rate	28 Gbit/s

Processing

Soldering Temperature JEDEC J-STD-020E	20–40 seconds at 260°C
MSL JEDEC J-STD-020E	1
Assembly	Pick and Place

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Derating Diagram

EC.8, 140 pages Part No. 408-52140-100-11

EC8 gerade 140pol mit key Foto

Number of poles: 140, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging

Perpendicular

SMT

Direct Connector

High Density

High Speed

show more product details

EC.8, 140 pages Part No. 408-52140-100-11 - Technical data

Basics

No. of Contacts	140
Termination Technology	SMT
Operating Temperature Range	-40°F to +125°F

Material

Insulator Material	LCP, UL 94 V-0
CTI value IEC 60112	200
Contact Material	copper alloy
Plating	Au over PdNi over Ni
Termination area	Sn over Ni

Mechanical

Pitch	0.8 mm
Mating Force per Pin	≤ 0.635 N
Separating Force per Pin	≥ 0.06 N
Durability IEC 60512-9-1	500 insertion cycles
Coplanarity	≤ 0.1 mm
Vibration, sinusoidal IEC 60512-6-4	10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5	≤ 1 µs
Shock, semi-sinusoidal IEC 60512-6-3	50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5	≤ 1 µs

Electrical

Operational Current IEC 60512-5-2	1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins)
Contact Resistance IEC 60512-2-1	≤ 15 mΩ
Clearance and Creepage	0.25 mm
Insulation Resistance IEC 60512-3-1	≥ 1 GΩ
Test Voltage IEC 60512-4-1	1100 VDC
Data Transfer Rate	28 Gbit/s

Processing

Soldering Temperature JEDEC J-STD-020E	20–40 seconds at 260°C
MSL JEDEC J-STD-020E	1
Assembly	Pick and Place

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Derating Diagram

EC.8, 160p Part No. 408-52160-100-12

EC8 gerade 160pol mit key Foto

Number of poles: 160, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Packaging Tray

Perpendicular

SMT

Direct Connector

High Density

High Speed

show more product details

EC.8, 160p Part No. 408-52160-100-12 - Technical data

Basics

No. of Contacts	160
Termination Technology	SMT
Operating Temperature Range	-40°F to +125°F

Material

Insulator Material	LCP, UL 94 V-0
CTI value IEC 60112	200
Contact Material	copper alloy
Plating	Au over PdNi over Ni
Termination area	Sn over Ni

Mechanical

Pitch	0.8 mm
Mating Force per Pin	≤ 0.635 N
Separating Force per Pin	≥ 0.06 N
Durability IEC 60512-9-1	500 insertion cycles
Coplanarity	≤ 0.1 mm
Vibration, sinusoidal IEC 60512-6-4	10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5	≤ 1 µs
Shock, semi-sinusoidal IEC 60512-6-3	50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5	≤ 1 µs

Electrical

Operational Current IEC 60512-5-2	1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins)
Contact Resistance IEC 60512-2-1	≤ 15 mΩ
Clearance and Creepage	0.25 mm
Insulation Resistance IEC 60512-3-1	≥ 1 GΩ
Test Voltage IEC 60512-4-1	1100 VDC
Data Transfer Rate	28 Gbit/s

Processing

Soldering Temperature JEDEC J-STD-020E	20–40 seconds at 260°C
MSL JEDEC J-STD-020E	1
Assembly	Pick and Place

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Derating Diagram

EC.8, exactly 180p Part No. 408-52180-100-12

EC8 gerade 180pol mit key Foto

Number of poles: 180, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Packaging Tray

Perpendicular

SMT

Direct Connector

High Density

High Speed

show more product details

EC.8, exactly 180p Part No. 408-52180-100-12 - Technical data

Basics

No. of Contacts	180
Termination Technology	SMT
Operating Temperature Range	-40°F to +125°F

Material

Insulator Material	LCP, UL 94 V-0
CTI value IEC 60112	200
Contact Material	copper alloy
Plating	Au over PdNi over Ni
Termination area	Sn over Ni

Mechanical

Pitch	0.8 mm
Mating Force per Pin	≤ 0.635 N
Separating Force per Pin	≥ 0.06 N
Durability IEC 60512-9-1	500 insertion cycles
Coplanarity	≤ 0.1 mm
Vibration, sinusoidal IEC 60512-6-4	10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5	≤ 1 µs
Shock, semi-sinusoidal IEC 60512-6-3	50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5	≤ 1 µs

Electrical

Operational Current IEC 60512-5-2	1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins)
Contact Resistance IEC 60512-2-1	≤ 15 mΩ
Clearance and Creepage	0.25 mm
Insulation Resistance IEC 60512-3-1	≥ 1 GΩ
Test Voltage IEC 60512-4-1	1100 VDC
Data Transfer Rate	28 Gbit/s

Processing

Soldering Temperature JEDEC J-STD-020E	20–40 seconds at 260°C
MSL JEDEC J-STD-020E	1
Assembly	Pick and Place

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Derating Diagram

EC.8, exactly 200p Part No. 408-52200-100-12

EC8 gerade 200pol mit key Foto

Number of poles: 200, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Packaging Tray

Perpendicular

SMT

Direct Connector

High Density

High Speed

show more product details

EC.8, exactly 200p Part No. 408-52200-100-12 - Technical data

Basics

No. of Contacts	200
Termination Technology	SMT
Operating Temperature Range	-40°F to +125°F

Material

Insulator Material	LCP, UL 94 V-0
CTI value IEC 60112	200
Contact Material	copper alloy
Plating	Au over PdNi over Ni
Termination area	Sn over Ni

Mechanical

Pitch	0.8 mm
Mating Force per Pin	≤ 0.635 N
Separating Force per Pin	≥ 0.06 N
Durability IEC 60512-9-1	500 insertion cycles
Coplanarity	≤ 0.1 mm
Vibration, sinusoidal IEC 60512-6-4	10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5	≤ 1 µs
Shock, semi-sinusoidal IEC 60512-6-3	50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5	≤ 1 µs

Electrical

Operational Current IEC 60512-5-2	1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins)
Contact Resistance IEC 60512-2-1	≤ 15 mΩ
Clearance and Creepage	0.25 mm
Insulation Resistance IEC 60512-3-1	≥ 1 GΩ
Test Voltage IEC 60512-4-1	1100 VDC
Data Transfer Rate	28 Gbit/s

Processing

Soldering Temperature JEDEC J-STD-020E	20–40 seconds at 260°C
MSL JEDEC J-STD-020E	1
Assembly	Pick and Place

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Derating Diagram

EC.8, exactly 200p Part No. 408-52200-103-12

EC8 gerade 200pol mit key Foto

Number of poles: 200, with encoding, Reinforcing strut along the isosceles section, Grid 0.8 mm, Data transfer rate: 28 Gbps, Packaging Tray

Perpendicular

SMT

Direct Connector

High Density

High Speed

show more product details

EC.8, exactly 200p Part No. 408-52200-103-12 - Technical data

Basics

No. of Contacts	200
Termination Technology	SMT
Operating Temperature Range	-40°F to +125°F

Material

Insulator Material	LCP, UL 94 V-0
CTI value IEC 60112	200
Contact Material	copper alloy
Plating	Au over PdNi over Ni
Termination area	Sn over Ni

Mechanical

Pitch	0.8 mm
Mating Force per Pin	≤ 0.635 N
Separating Force per Pin	≥ 0.06 N
Durability IEC 60512-9-1	500 insertion cycles
Coplanarity	≤ 0.1 mm
Vibration, sinusoidal IEC 60512-6-4	10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5	≤ 1 µs
Shock, semi-sinusoidal IEC 60512-6-3	50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5	≤ 1 µs

Electrical

Operational Current IEC 60512-5-2	1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins)
Contact Resistance IEC 60512-2-1	≤ 15 mΩ
Clearance and Creepage	0.25 mm
Insulation Resistance IEC 60512-3-1	≥ 1 GΩ
Test Voltage IEC 60512-4-1	1100 VDC
Data Transfer Rate	28 Gbit/s

Processing

Soldering Temperature JEDEC J-STD-020E	20–40 seconds at 260°C
MSL JEDEC J-STD-020E	1
Assembly	Pick and Place

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Derating Diagram

Other number of contacts? Other stacking heights? alternative plating? Individual assembly? Lagging contacts?

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EC.8: High-speed direct-connect system

Highspeed mit Pfeile

The EC.8’s direct-plug design enables data transfer rates of up to 28 Gbit/s.
Unlike traditional connectors, direct-plug connectors minimize a wide variety of obstacles such as changes in direction, reflections, and changes in cross-section, ensuring clear signal transmission.
A detailed report on the high-speed characteristics, as well as S-parameters for simulating your own design, are available upon request: sales@eptusa.com

EC.8 Direktsteckverbindersystem
Details at a Glance

Lead-in chamfers
to compensate for axial and angular misalignment during assembly

Auditory and tactile feedback
to ensure proper contact with the plug-in card

Coplanarity
Reliable soldering during processing

Encoding bar
Anti-twist protection and tolerance compensation for the plug-in card

Coding pin
prevents the connector from twisting on the board

Motive Web Kurzbeschreibung Kontakt 1640x1195px

We manufacture custom-fit, custom connectors tailored to your application.

Other pin counts
Other stack heights
Alternative contact coatings

Request a custom connector now
sales@eptusa.com

Direct plug vs. connector pair

The direct connector allows for direct contact with the printed circuit board without the need for a mating connector. As a result, there are fewer contact points and transitions compared to a blade-spring pair, which has a positive effect on current-carrying capacity and data transmission performance.

Direct connector:

[1] R _{contact interface}
[2] R _contact
[3] R _{connection area}

Pair of connectors:

[1] R _{Terminal block}
[2] R _Contact
[3] R _{Contact junction}
[4] R _Contact
[5] R _{Terminal block}

Tolerances

Center Misalignment for EC.8 Direct Connectors
Permissible Center Misalignment

Tolerances EC.8 direct connectors tolerate a misalignment of 0.6 mm along the longitudinal axis and 0.7 mm along the transverse axis during connection.

Angular Misalignment for EC.8 Direct Connectors
Permissible Angular Misalignment Tolerances

With EC.8 direct connectors, the daughter card can be inserted into the EC.8 connector at an angle of up to 5° along both the longitudinal and transverse axes.

EC.8 SMT surface-mount connectors with a 0.8 mm pitch

Unbenannt 1

Are you looking for maximum performance with minimal space requirements? Do you need a direct connector that’s built for high-speed performance? Thanks to its

design, our EC.8 is a true high-speed expert, offering data transfer rates of up to 28 Gbit/s. It’s the perfect solution for modern Industry 4.0 applications and related fields such as the Internet of Things, cloud computing, and edge computing.
In addition to its high data transfer rate, the direct connector offers the following advantages: Direct contact with a printed circuit board saves space and
resources, as material costs and the assembly effort for the pin header are completely eliminated. The technical advantage stems from the reduction of resistance and interference that can affect a signal.
To provide the right direct connector for every application, our EC.8 is available in the industry-proven 0.8 mm pitch with a range of 20 to 200 signal pins, selectable in increments of 20.

The EC.8 family has undergone an extensive testing program, demonstrating proper function after environmental storage, shock and vibration exposure, and even after 500 mating cycles. Request the EC.8 HighSpeed Report and the S-parameters today for detailed facts and figures.

FAQ: Questions and Answers About EC.8 SMT PCB Connectors

How can EC.8 direct-plug connectors be installed?What specifications or layout should be used to manufacture the plug-in card?Why should a direct-connect connector system be used?Is the EC.8 connector system compatible with common daughter card specifications?What applications are EC.8 direct connectors used for?What amount of misalignment do EC.8 direct connectors tolerate when inserting the daughter card?What data rates can be transmitted?What types of power can be transmitted?Are EC.8 connectors UL-recognized components?Are the EC.8 connectors RoHS-compliant?

How can EC.8 direct-plug connectors be installed?

The through-hole connectors are manufactured using surface mount technology (SMT). Soldering is performed directly onto the printed circuit board. For pin counts
ranging from 20 to 140, the connectors are shipped in industry-standard tape-and-reel packaging, which enables fully automated pick-and-place assembly.
Pole counts from 160 to 200 are packaged in trays as standard; tape-and-reel packaging is also available upon request. However, this uses a wider tape, which is less common.

What specifications or layout should be used to manufacture the plug-in card?

Please refer to the drawing below for the chamfering and dimensions of the circuit board. We recommend hard gold for the gold pads. Please refer to the product drawing for further details.

Anphasung EC8

Why should a direct-connect connector system be used?

Direct-connect systems enable high data transfer rates. Compared to two-piece connector systems, these systems eliminate the negative effects of the second connector on the signal. This is primarily due to the reduced number of contact points, fewer changes in conductor cross-section, and the resulting fewer changes in the signal’s direction.
Thus, high performance can be achieved even with a small footprint. Additionally, the contact resistance is reduced compared to two-part connector systems, resulting in increased current-carrying capacity.

Is the EC.8 connector system compatible with common daughter card specifications?

The EC.8 connector system supports daughter cards with a thickness of 1.60 mm. For connectors with 80 or more contacts, a retaining bar is integrated to prevent incorrect insertion. This bar can be omitted in the 60-pin version if desired.
The EC.8 connector system complies with current market standards and is compatible with widely used boards.

What applications are EC.8 direct connectors used for?

Thanks to their versatility, EC.8 direct connectors are used in a wide variety of applications across numerous industries. In the fields of automation technology and IoT devices, for example, they offer the benefits of a fine pitch and high data transfer rates.

What amount of misalignment do EC.8 direct connectors tolerate when inserting the daughter card?

An angular misalignment of up to 5° is acceptable in both the longitudinal and transverse directions.
A misalignment of 0.7 mm perpendicular to and 0.6 mm parallel to the longitudinal axis of the connector is acceptable.

EC8 Mitten Winkelversatz

What data rates can be transmitted?

The data transfer rate is 28 Gbit/s. The following graph shows the insertion loss versus frequency.

EC8 Insertion loss

What types of power can be transmitted?

A 140-pin connector can carry up to 3.2 A at an ambient temperature of 20°C. For more detailed information, please contact us at sales@eptusa.com

Are EC.8 connectors UL-recognized components?

Yes, ept's EC.8 connectors are UL-recognized components in the United States and Canada.

Are the EC.8 connectors RoHS-compliant?

RoHS (Restriction of the Use of Certain Hazardous Substances) is the directive restricting the use of certain hazardous substances in electrical and electronic equipment.
We confirm that ept’s EC.8 connectors are compliant with RoHS Directive 2011/65/EU, as evidenced by the RoHS certificate. For more information, please visit RoHS & REACH

Connectors ept Products EC.8 - 0.8 mm Edge Card SMT

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