High-speed direct connector connections up to 28 Gbit/s

The EC.8's direct-connect design enables data transfer speeds of up to 28 Gbit/s.
EC8 Highspeed mit Pfeile.Produktseite

Features

  • card edge connector
  • , 20 to 200 contacts
  • , 28 Gbit/s data rate, 3
    • 2 A current-carrying capacity, 500
  • mating cycles, packaged
  • in tape & reel, tray
  • , 1.60 mm daughter board thickness

Applications

  • Embedded
  • Industrial Automation
  • Datacom
Filter
EC.8 - straight

EC.8, just 20p Part No. 408-52020-000-11

EC8 gerade 20pol ohne key Foto
Number of poles: 20, without encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8, just 20p Part No. 408-52020-000-11 - Technical data

Basics

No. of Contacts20
Termination TechnologySMT
Operating Temperature Range-40°F to +125°F

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact Materialcopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Test Voltage
IEC 60512-4-1
1100 VDC
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Data Transfer Rate28 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
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EC.8 exactly 40p Part No. 408-52040-000-11

EC8 gerade 40pol ohne key Foto
Number of poles: 40, without encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 exactly 40p Part No. 408-52040-000-11 - Technical data

Basics

No. of Contacts40
Termination TechnologySMT
Operating Temperature Range-40°F to +125°F

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact Materialcopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Test Voltage
IEC 60512-4-1
1100 VDC
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Data Transfer Rate28 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
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EC.8, exactly 60p Part No. 408-52060-000-11

EC8 gerade 60pol ohne key Foto
Number of poles: 60, without encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8, exactly 60p Part No. 408-52060-000-11 - Technical data

Basics

No. of Contacts60
Termination TechnologySMT
Operating Temperature Range-40°F to +125°F

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact Materialcopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Test Voltage
IEC 60512-4-1
1100 VDC
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Data Transfer Rate28 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
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EC.8, exactly 60p Part No. 408-52060-100-11

EC8 gerade 60pol mit key Foto
Number of poles: 60, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8, exactly 60p Part No. 408-52060-100-11 - Technical data

Basics

No. of Contacts60
Termination TechnologySMT
Operating Temperature Range-40°F to +125°F

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact Materialcopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Test Voltage
IEC 60512-4-1
1100 VDC
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Data Transfer Rate28 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
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EC.8 exactly 80p Part No. 408-52080-100-11

EC8 gerade 80pol mit key Foto
Number of poles: 80, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 exactly 80p Part No. 408-52080-100-11 - Technical data

Basics

No. of Contacts80
Termination TechnologySMT
Operating Temperature Range-40°F to +125°F

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact Materialcopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Test Voltage
IEC 60512-4-1
1100 VDC
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Data Transfer Rate28 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
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EC.8 exactly 100p Part No. 408-52100-100-11

EC8 gerade 100pol mit key Foto
Number of poles: 100, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 exactly 100p Part No. 408-52100-100-11 - Technical data

Basics

No. of Contacts100
Termination TechnologySMT
Operating Temperature Range-40°F to +125°F

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact Materialcopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Test Voltage
IEC 60512-4-1
1100 VDC
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Data Transfer Rate28 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
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EC.8 straight 120p Part No. 408-52120-100-11

EC8 gerade 120pol mit key Foto
Number of poles: 120, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 straight 120p Part No. 408-52120-100-11 - Technical data

Basics

No. of Contacts120
Termination TechnologySMT
Operating Temperature Range-40°F to +125°F

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact Materialcopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Test Voltage
IEC 60512-4-1
1100 VDC
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Data Transfer Rate28 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
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EC.8, 140 pages Part No. 408-52140-100-11

EC8 gerade 140pol mit key Foto
Number of poles: 140, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Tape-and-reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8, 140 pages Part No. 408-52140-100-11 - Technical data

Basics

No. of Contacts140
Termination TechnologySMT
Operating Temperature Range-40°F to +125°F

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact Materialcopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Test Voltage
IEC 60512-4-1
1100 VDC
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Data Transfer Rate28 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
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EC.8, 160p Part No. 408-52160-100-12

EC8 gerade 160pol mit key Foto
Number of poles: 160, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Packaging Tray
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8, 160p Part No. 408-52160-100-12 - Technical data

Basics

No. of Contacts160
Termination TechnologySMT
Operating Temperature Range-40°F to +125°F

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact Materialcopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Test Voltage
IEC 60512-4-1
1100 VDC
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Data Transfer Rate28 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
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Yes, load content from Supplyframe

EC.8, exactly 180p Part No. 408-52180-100-12

EC8 gerade 180pol mit key Foto
Number of poles: 180, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Packaging Tray
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8, exactly 180p Part No. 408-52180-100-12 - Technical data

Basics

No. of Contacts180
Termination TechnologySMT
Operating Temperature Range-40°F to +125°F

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact Materialcopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Test Voltage
IEC 60512-4-1
1100 VDC
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Data Transfer Rate28 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
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Yes, load content from Supplyframe

EC.8, exactly 200p Part No. 408-52200-100-12

EC8 gerade 200pol mit key Foto
Number of poles: 200, with encoding, for 1.6 mm daughter cards, Grid 0.8 mm, Data transfer rate: 28 Gbps, Packaging Tray
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8, exactly 200p Part No. 408-52200-100-12 - Technical data

Basics

No. of Contacts200
Termination TechnologySMT
Operating Temperature Range-40°F to +125°F

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact Materialcopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Test Voltage
IEC 60512-4-1
1100 VDC
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Data Transfer Rate28 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
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EC.8, exactly 200p Part No. 408-52200-103-12

EC8 gerade 200pol mit key Foto
Number of poles: 200, with encoding, Reinforcing strut along the isosceles section, Grid 0.8 mm, Data transfer rate: 28 Gbps, Packaging Tray
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8, exactly 200p Part No. 408-52200-103-12 - Technical data

Basics

No. of Contacts200
Termination TechnologySMT
Operating Temperature Range-40°F to +125°F

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact Materialcopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Test Voltage
IEC 60512-4-1
1100 VDC
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Data Transfer Rate28 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
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Other number of contacts? Other stacking heights? alternative plating? Individual assembly? Lagging contacts?
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EC.8: High-speed direct-connect system

Highspeed mit Pfeile
The EC.8’s direct-plug principle enables data transfer rates of up to 28 Gbit/s.
Unlike traditional connectors, card edge connectors minimize a wide variety of obstacles such as changes in direction, reflections, and changes in cross-section, which ensures clear signal transmission.
A detailed report on the high-speed characteristics, as well as S-parameter for simulating your own design, are available upon request: sales@eptusa.com
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EC.8 Direktsteckverbindersystem

Details at a Glance

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Lead-in chamfers

to compensate for center and angular misalignment during mating

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Auditory and tactile feedback

to ensure proper contact of the plug-in card

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Coplanarity

Reliable soldering during processing

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keying rib

anti-rotation feature and tolerance compensation for the plug-in card

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coding key

prevents the connector from twisting on the board

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We manufacture custom-fit, tailored connector for your application.
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  • Other stack heights
  • Alternative contact plating
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card edge connector vs. mated connector pair

The direct connector (card edge connector) enables direct contact with the printed circuit board without a corresponding mating connector (mating connector). Compared to a spring-blade pair, this results in fewer contact points and transitions, which positively affects current-current-carrying capacity, and data transmission characteristics.
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card edge connector:

[1] R Kontaktübergang
[2] R Kontakt
[3] R termination area
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mated connector pair:

[1] R termination area
[2] R Kontakt
[3] R Kontaktübergang
[4] R Kontakt
[5] R termination area

Tolerances

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radial misalignment at EC.8 card edge connectors
Permitted radial misalignment

Tolerances EC.8 card edge connector tolerate an offset of 0.6 mm along the longitudinal axis and 0.7 mm along the transverse axis during mating.
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Angular angular misalignment in EC.8 card edge connectors
Permitted Angular Offset Tolerances

With EC.8 card edge connectors, the daughtercard can be inserted into the EC.8 at an angle of up to 5° along both the longitudinal and transverse axes.

EC.8 SMT card edge connector with a 0.8 mm pitch

Unbenannt 1
Do you want maximum performance with minimal space requirements? Do you need a direct connector (card edge connector) that has “HighSpeed” in its DNA?

Thanks to its design, our EC.8 is already a high-speed pro, offering data transfer rates of up to 28 Gbit/s. It’s just right for modern Industry 4.0 applications and related fields such as the Internet of Things, cloud computing, and edge computing.
In addition to its high data rate, the direct connector (card edge connector) offers the following advantages:
Direct contact with a printed circuit board saves space and resources, as material costs and the assembly effort for the Male are completely eliminated. The technical advantage stems from the reduction in resistance and interference that can affect a signal.
To provide the right card edge connector for every application, our EC.8 is available in the industry-proven 0.8 mm pitch with a range of 20 to 200 signal pins, selectable in increments of 20.

The EC.8 family has undergone an extensive testing program, demonstrating proper function after, among other things, climate storage, shock and vibration exposure, and even after 500 mating cycles. Curious? Request the EC.8 HighSpeed Report and the S-parameter right away and see for yourself with facts and figures.

FAQ: Questions and Answers About EC.8 SMT-Leiterplattensteckverbindern

How can EC.8 direct-plug connectors be installed?According to which specification or layout must the plug-in card be manufactured?Why should a direct-card edge connector system be used?Is the EC.8 connector system compatible with common daughter card specifications?For which applications are EC.8 direct connectors (card edge connector) used?What misalignment do EC.8 direct connectors (card edge connector) tolerate when inserting the daughter card (daughtercard)?What data rates can be transmitted?What types of power can be transmitted?Are EC.8 connector UL-recognized components?Are the EC.8 connector RoHS-compliant?
How can EC.8 direct-plug connectors be installed?

The direct-plug connectors are processed using Surface Mount Technology (SMT). Soldering is performed directly onto the printed circuit board. For a number of positions ranging from 20 to 140,
products are shipped in industry-standard tape and reel-Verpackung; this enables fully automated processing via pick-and-place.
Connectors with a number of positions from 160 to 200 are packaged in a tray by default; tape and reel-Verpackung is also available upon request. However, this uses a wider tape, which is less common.

According to which specification or layout must the plug-in card be manufactured?

Please refer to the drawing below for the chamfering and dimensions of the printed circuit board. We recommend “hard gold” for the gold pads. Please refer to the product drawing for further details.

Anphasung EC8
Why should a direct-card edge connector system be used?

High data rates can be achieved using direct-plug systems. Compared to two-part connector systems, these eliminate the negative effects of the second connector on the signal. This is primarily due to the reduced number of contact points, fewer changes in the conductor’s cross-section, and the resulting fewer changes in the signal’s direction.
This allows for high performance even with a small footprint. Additionally, the contact resistance is reduced compared to two-part connector systems, resulting in increased current-carrying capacity.

Is the EC.8 connector system compatible with common daughter card specifications?

The EC.8 connector system supports daughtercards with a thickness of 1.60 mm. For connectors with 80 or more contacts, a spacer is also integrated to prevent incorrect insertion. This spacer can be omitted in the 60-pin version if desired.
The EC.8 connector-System complies with current market standards and is compatible with widely used boards.

For which applications are EC.8 direct connectors (card edge connector) used?

Due to their versatility, EC.8 direct connectors (card edge connector) are used in a wide variety of applications across numerous industries. In the fields of automation technology and IoT devices, for example, they benefit from their small pitch and high data rates.

What misalignment do EC.8 direct connectors (card edge connector) tolerate when inserting the daughter card (daughtercard)?

An angular offset (angular misalignment) of up to 5° is tolerated in both the longitudinal and transverse directions.
An offset of 0.7 mm perpendicular to and 0.6 mm parallel to the longitudinal axis of the connector is tolerated.

EC8 Mitten Winkelversatz
What data rates can be transmitted?

The data transfer rate is 28 Gbit/s. The following diagram shows the insertion loss (insertion loss) versus frequency.

EC8 Insertion loss
What types of power can be transmitted?

A 140-pin connector transmits up to 3.2 A at an ambient temperature of 20°C. For more detailed information, please contact us at sales@eptusa.com

Are EC.8 connector UL-recognized components?

Yes, EC.8 connector from ept are UL-recognized components in the U.S. and Canada.

Are the EC.8 connector RoHS-compliant?

RoHS (Restriction of the Use of Certain Hazardous Substances) is the directive restricting the use of certain hazardous substances in electrical and electronic equipment.
We confirm that EC.8 connector from ept are compliant with RoHS Directive 2011/65/EU, as per the RoHS certificate. For more information, see RoHS & REACH

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