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MTCA Power Module Output Part No. 501-50096-183
Illustration similar
Perpendicular
Press-fit
Power
Rugged
- Number of pins: 72 signal, 24 power
- Connection technology: Press-fit
- complies with PICMG requirements
Technical Specifications
Basics
| Specification | PICMG® MTCA.0 R1.0 |
|---|---|
| No. of Contacts | 96 (24 power contacts, 72 signal contacts) |
| Termination Technology | Press-fit technology |
| Termination Length | 3.5 mm |
| Operating Temperature Range | -55°F to +105°F |
Material
| Insulator Material | Glass-fiber-reinforced PBT, UL 94 V-0 |
|---|---|
| Contact Material | copper alloy |
Mechanical
| Mating Force | max. 50 N |
|---|---|
| Separating Force | max. 50 N |
| Durability | 200 insertion cycles |
Electrical
| Operational Current | Power contacts: max. 12 A, signal contacts: max. 1 A |
|---|---|
| Insulation Resistance | ≥ 108 Ω |
| Test Voltage | 80 V r.m.s. |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Hole Specifications
| Material | chem. Sn Schicht |
|---|---|
| Nennloch | Ø 0.6 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 0.60 ±0.05 mm |
| C Grundbohrung | 0.70 ±0.02 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | max. 1.5 µm; chem. Sn Leiterplatten |
| F Restring | min. 0.1 mm |
| Material | Ni, Au Leiterplatten |
|---|---|
| Nennloch | Ø 0.6 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 0.60 ±0.05 mm |
| C Grundbohrung | 0.70 ±0.02 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | Ni, Au Schicht, 0.05 - 0.2 µm Au über 2.5 - 5 µm Ni |
| F Restring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Matching Products
Processing
Packaging
Tray
15 pieces per tray
4 trays / box