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Zero8 plug low-profile unshielded Part No. 405-52032-51
Illustration similar
Parallel
SMT
High Density
High Speed
Rugged
- 32 pins
- unmated stacking height: 1.15 mm
- SMT
- 0.8 mm pitch
- Performance level 1
Technical Specifications
Basics
Performance Level IEC 60512-9-1:2010 | 1 |
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No. of Contacts | 32 |
Termination Technology | SMT |
Board-to-Board Distance | 6.0 mm to 13.5 mm |
Operating Temperature Range | -55°C to + 125°C |
Material
Insulator Material | LCP, UL 94 V-0 |
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CTI value IEC 60112 | 150 |
Contact Material | Copper alloy |
Plating | Au over Ni |
Termination area | Sn over Ni |
Mechanical
Pitch | 0.8 mm |
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Mating Force per Pin | ≤ 0.5 N |
Separating Force per Pin | ≤ 0.4 N |
Durability IEC 60512-9-1 | 500 mating cycles |
Coplanarity | ≤ 0.1 mm |
Vibration, sinusoidal IEC 60512-6-4 | 10 - 2000 Hz, 20g |
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5 | ≤ 1 µs |
Shock, semi-sinusoidal IEC 60512-6-3 | 50g, 11 ms |
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5 | ≤ 1 µs |
Electrical
Operational Current IEC 60512-5-2 | 1.7 A per pin at 20°C (80 of 80 pins supplied with current) 5.5 A per pin at 20°C (2 of 80 pins supplied with current) 5.1 A per pin at 20°C (4 of 80 pins supplied with current) 16 A at 20°C (shield supplied with current) |
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Contact Resistance IEC 60512-2-1 | ≤ 20 mΩ |
Clearance and Creepage | 0.25 mm |
Insulation Resistance IEC 60512-3-1 | > 5 GΩ |
Test Voltage IEC 60512-4-1 | 500 VAC |
Data Transfer Rate | 16 Gbps |
Processing
Soldering Temperature JEDEC J-STD-020E | 20 - 40 s at 260°C |
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MSL JEDEC J-STD-020E | 1 |
Assembly | Pick and Place |
Approval / Compliance
UL file | E130314 |
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Environment | RoHS konform |
Matching Products
Modifications
Available on request
- different number of pins
- other performance level
Packaging
Tape and Reel
500 pcs / Reel