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- Technical Specifications
- Hole Specifications
- Accessories
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DIN 41612 straight spring-loaded connector, Type G Part No. 112-60065
Illustration similar
Perpendicular
Press-fit
Power
Rugged
- Connection length: 22 mm
- Terminal side tin-plated for wire wrap
- Number of poles: 64
- Press-fit technology
- Grade 2
Technical Specifications
Basics
| Specification | IEC 60603-2 (DIN 41612) |
|---|---|
| Performance Level | 2 |
| No. of Contacts | 64 |
| Termination Technology | Press-fit technology |
| Termination Length | 22 mm |
| Operating Temperature Range | -55°C to +125°C |
Material
| Insulator Material | Glass-fiber-reinforced PBT, UL 94 V-0 |
|---|---|
| CTI value IEC 60112 | 200 |
| Contact Material | copper alloy |
Mechanical
| Pitch | 5.08 x 3.81 mm |
|---|---|
| Mating Force | 100 N |
| Separating Force per Pin | >0.2 N |
| Durability | 400 insertion cycles |
Electrical
| Operational Current | 5.6 A |
|---|---|
| Contact Resistance | 15 mΩ |
| Clearance and Creepage | W: ≥ 3.0 mm, L: ≥ 1.6 mm |
| Insulation Resistance | >106 MΩ |
| Test Voltage | 1550 V |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Hole Specifications
| Material | chem. Sn Leiterplatten |
|---|---|
| Nennloch | Ø 1.6 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 1.6 +0.09 / -0.06 mm |
| C Grundbohrung | 1.75 ±0.025 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | chem. Sn Schicht, max. 1.5 µm |
| F Restring | min. 0.1 mm |
| Material | Ni, Au Leiterplatten |
|---|---|
| Nennloch | Ø 1.6 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 1.6 +0.09 / -0.06 mm |
| C Grundbohrung | 1.75 ±0.025 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | Ni, Au Schicht, 0.05 - 0.2 µm Au über 2.5 - 5 µm Ni |
| F Restring | min. 0.1 mm |
| Material | rein Cu Leiterplatten |
|---|---|
| Nennloch | Ø 1.6 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 1.6 +0.09 / -0.06 mm |
| C Grundbohrung | 1.75 ±0.025 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | OSP*, z.B. GLICOAT-SMD (F2) mit 0.12 - 0.15 µm |
| F Restring | min. 0.1 mm |
| Material | HAL Sn Leiterplatten |
|---|---|
| Nennloch | Ø 1.6 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 1.6 +0.09 / -0.06 mm |
| C Grundbohrung | 1.75 ±0.025 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | HAL Sn, 5 - 15 µm |
| F Restring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Accessories
Modifications
Available on request
- without mounting flange
- Special lengths for connections
- Grade I + III or custom
- Special configuration
Processing
Packaging
Cardboard
14 pieces per box
10 cartons per box