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- Description
- Technical Specifications
- Hole Specifications
- Matching Products
- Accessories
- Modifications
- Processing
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Velox Center Part No. 308-50102-41

Illustration similar
Perpendicular
Press-fit
High Speed
Rugged


- Surface of press-fit zone: SnPb
- Custom-configured (71 pins)
- Connection technology: Press-fit
- 1.8 mm grid
- Data transfer rate: 10 Gbit/s
Technical Specifications
Basics
| Specification | VITA 46 |
|---|---|
| No. of Contacts | 71 |
| Termination Technology | Press-fit technology |
| Termination Length | 1.62 mm |
| Operating Temperature Range | -55°F to +105°F |
Material
| Insulator Material | LCP, UL 94 V-0 |
|---|---|
| CTI value IEC 60112 | 175 |
| Contact Material | Phosphor bronze |
| Plating | 1.27 µm Au over Ni on the contact area, SnPb on the press-fit zone |
Mechanical
| Pitch | 1.8 mm |
|---|---|
| Mating Force per Pin | max. 0.75 N |
| Separating Force per Pin | at least 0.15 N |
| Durability | 200 insertion cycles |
Electrical
| Operational Current | 1.0 A (<30°C) |
|---|---|
| Operational Voltage | 50 VAC peak or DC |
| Contact Resistance | max. 80 mΩ |
| Clearance and Creepage | ≥ 0.7 mm |
| Insulation Resistance | at least 1000 MΩ |
| Test Voltage | 500 V (AC/DC) |
| Data Transfer Rate | 10 Gbit/s |
Approval / Compliance
| UL file | E130314 |
|---|
Hole Specifications

| Material | chem. Sn Schicht |
|---|---|
| Nennloch | Ø 0.56 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 0.56 ±0.05 mm |
| C Grundbohrung | 0.65 ±0.02 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | chem. Sn Schicht, max. 1.5 µm |
| F Restring | min. 0.1 mm |
| Material | Ni, Au Leiterplatten |
|---|---|
| Nennloch | Ø 0.56 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 0.56 ±0.05 mm |
| C Grundbohrung | 0.65 ±0.02 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | Ni, Au Schicht, 0.05 - 0.2 µm Au über 2.5 - 5 µm Ni |
| F Restring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Matching Products
Accessories
Modifications
Available on request
- various versions, each with its own configuration
Processing
Packaging
Tray
20 pieces per tray
10 trays per box



