flexilink b-t-b, 25 mm height Part No. 990-52XNN250-110

Name: flexilink b-t-b, 25 mm height
Rating: 4.3 (32 reviews)

flexilink B2B PCB connector, 25 mm height

Illustration similar

Parallel

Press-fit

Power

Rugged

25 mm height
for a two-stage press-fit process
1–3 rows of contacts
Saves space and costs; replaces spacers
Part number code: X = number of rows, NN = number of poles per row
For inquiries, please contact our sales department.

Drawings

Further Information

Delivery time

Technical Specifications

Basics

No. of Contacts	2–90 (max. 30 per row)
Termination Technology	Press-fit technology
Board-to-Board Distance	25 mm
Operating Temperature Range	-40°F to +125°F

Material

Insulator Material	PBT
CTI value IEC 60112	250
Contact Material	copper alloy
Plating	Sn

Mechanical

Pitch	2.54 mm or custom-configured

Electrical

Operational Current	Max. 11 A at 20°C per pin (1x10-pin, 15 mm height) Max. 7 A at 20°C per pin (2x10-pin, 15 mm height) Max. 6 A at 20°C per pin (3x10-pin, 15 mm height)
Contact Resistance	5 mΩ
Clearance and Creepage	min. 0.44 mm / 0.57 mm (within the row) min. 1.94 / 2.07 mm (between rows)

Processing

Assembly	manual / semi-automatic / fully automatic

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Derating Diagram

Ambient temperature [°C]	Max. 7.3 A at 20°C (2-row)	Max. 10.2 A at 20°C (single-row)	Max. 6.4 A at 20°C (3-row)
0	125	125	125
0.2	124.76953125	124.89296875	124.8359375
0.4	124.390625	124.709375	124.46875
0.6	123.86328125	124.44921875	123.8984375
0.8	123.1875	124.1125	123.125
1	122.36328125	123.69921875	122.1484375
1.2	121.390625	123.209375	120.96875
1.4	120.26953125	122.64296875	119.5859375
1.6	119	122	118
1.8	117.58203125	121.28046875	116.2109375
2	116.015625	120.484375	114.21875
2.2	114.30078125	119.61171875	112.0234375
2.4	112.4375	118.6625	109.625
2.6	110.42578125	117.63671875	107.0234375
2.8	108.265625	116.534375	104.21875
3	105.95703125	115.35546875	101.2109375
3.2	103.5	114.1	98
3.4	100.89453125	112.76796875	94.5859375
3.6	98.140625	111.359375	90.96875
3.8	95.23828125	109.87421875	87.1484375
4	92.1875	108.3125	83.125
4.2	88.98828125	106.67421875	78.8984375
4.4	85.640625	104.959375	74.46875
4.6	82.14453125	103.16796875	69.8359375
4.8	78.5	101.3	65
5	74.70703125	99.35546875	59.9609375
5.2	70.765625	97.334375	54.71875
5.4	66.67578125	95.23671875	49.2734375
5.6	62.4375	93.0625	43.625
5.8	58.05078125	90.81171875	37.7734375
6	53.515625	88.484375	31.71875
6.2	48.83203125	86.08046875	25.4609375
6.4	44	83.6	19
6.6	39.01953125	81.04296875	12.3359375
6.8	33.890625	78.409375	5.46875
7	28.61328125	75.69921875	-1.6015625
7.2	23.1875	72.9125
7.4	17.61328125	70.04921875
7.6	11.890625	67.109375
7.8	6.01953125	64.09296875
8	-1.13686837722E-13	61
8.2		57.83046875
8.4		54.584375
8.6		51.26171875
8.8		47.8625
9		44.38671875
9.2		40.834375
9.4		37.20546875
9.6		33.5
9.8		29.71796875
10		25.859375
10.2		21.92421875
10.4		17.9125
10.6		13.82421875
10.8		9.659375
11		5.41796875
11.2		1.1
11.4		-3.29453125
11.6

Ambient temperature [°C]	Max. 8.1 A at 20°C (2x2-pole)	Max. 5.6 A at 20°C (2x20-pin)	Max. 5.2 A at 20°C (2x30-pin)
0	125	125	125
0.2	124.794270833	124.625	124.6640625
0.4	124.46875	124	124.03125
0.6	124.0234375	123.125	123.1015625
0.8	123.458333333	122	121.875
1	122.7734375	120.625	120.3515625
1.2	121.96875	119	118.53125
1.4	121.044270833	117.125	116.4140625
1.6	120	115	114
1.8	118.8359375	112.625	111.2890625
2	117.552083333	110	108.28125
2.2	116.1484375	107.125	104.9765625
2.4	114.625	104	101.375
2.6	112.981770833	100.625	97.4765625
2.8	111.21875	97	93.28125
3	109.3359375	93.125	88.7890625
3.2	107.333333333	89	84
3.4	105.2109375	84.625	78.9140625
3.6	102.96875	80	73.53125
3.8	100.606770833	75.125	67.8515625
4	98.125	70	61.875
4.2	95.5234375	64.625	55.6015625
4.4	92.8020833333	59	49.03125
4.6	89.9609375	53.125	42.1640625
4.8	87	47	35
5	83.9192708333	40.625	27.5390625
5.2	80.71875	34	19.78125
5.4	77.3984375	27.125	11.7265625
5.6	73.9583333333	20	3.375
5.8	70.3984375	12.625	-5.2734375
6	66.71875	5
6.2	62.9192708333	-2.875
6.4	59
6.6	54.9609375
6.8	50.8020833333
7	46.5234375
7.2	42.125
7.4	37.6067708333
7.6	32.96875
7.8	28.2109375
8	23.3333333333
8.2	18.3359375
8.4	13.21875
8.6	7.98177083333
8.8	2.625
9	-2.8515625
9.2

Ambient temperature [°C]	Max. 7.8 A at 20°C (2x2 powered)	Max. 7.1 A at 20°C (2x4 powered)	Max. 5.2 A at 20°C (at full load)
0	125	125	125
0.2	124.83984375	124.958333333	124.6640625
0.4	124.546875	124.75	124.03125
0.6	124.12109375	124.375	123.1015625
0.8	123.5625	123.833333333	121.875
1	122.87109375	123.125	120.3515625
1.2	122.046875	122.25	118.53125
1.4	121.08984375	121.208333333	116.4140625
1.6	120	120	114
1.8	118.77734375	118.625	111.2890625
2	117.421875	117.083333333	108.28125
2.2	115.93359375	115.375	104.9765625
2.4	114.3125	113.5	101.375
2.6	112.55859375	111.458333333	97.4765625
2.8	110.671875	109.25	93.28125
3	108.65234375	106.875	88.7890625
3.2	106.5	104.333333333	84
3.4	104.21484375	101.625	78.9140625
3.6	101.796875	98.75	73.53125
3.8	99.24609375	95.7083333333	67.8515625
4	96.5625	92.5	61.875
4.2	93.74609375	89.125	55.6015625
4.4	90.796875	85.5833333333	49.03125
4.6	87.71484375	81.875	42.1640625
4.8	84.5	78	35
5	81.15234375	73.9583333333	27.5390625
5.2	77.671875	69.75	19.78125
5.4	74.05859375	65.375	11.7265625
5.6	70.3125	60.8333333333	3.375
5.8	66.43359375	56.125	-5.2734375
6	62.421875	51.25
6.2	58.27734375	46.2083333333
6.4	54	41
6.6	49.58984375	35.625
6.8	45.046875	30.0833333333
7	40.37109375	24.375
7.2	35.5625	18.5
7.4	30.62109375	12.4583333333
7.6	25.546875	6.25
7.8	20.33984375	-0.125
8	15
8.2	9.52734375
8.4	3.921875
8.6	-1.81640625
8.8

Hole Specifications

Material	chem. Sn Leiterplatten
Nennloch	Ø 1.0 mm
A Leiterplattendicke	min. 1.4 mm
B Endloch	Ø 1.0 +0.09 / -0.06 mm
C Grundbohrung	1.15 ±0.025 mm
D Cu Schicht	min. 25 µm
E Oberfläche	chem. Sn Schicht, max. 1.5 µm
F Restring	min. 0.1 mm

Material	Ni, Au Leiterplatten
Nennloch	Ø 1.0 mm
A Leiterplattendicke	min. 1.4 mm
B Endloch	Ø 1.0 +0.09 / -0.06 mm
C Grundbohrung	1.15 ±0.025 mm
D Cu Schicht	min. 25 µm
E Oberfläche	Ni, Au Schicht, 0.05 - 0.2 µm Au über 2.5 - 5 µm Ni
F Restring	min. 0.1 mm

Material	rein Cu Leiterplatten
Nennloch	Ø 1.0 mm
A Leiterplattendicke	min. 1.4 mm
B Endloch	Ø 1.0 +0.09 / -0.06 mm
C Grundbohrung	1.15 ±0.025 mm
D Cu Schicht	min. 25 µm
E Oberfläche	OSP, z.B. GLICOAT-SMD (F2) mit 0.12 - 0.15 µm
F Restring	min. 0.1 mm

Plated through-hole according to IEC 60352-5

Modifications Packaging Downloads Stock Check

Modifications

Available on request

other configuration options

Packaging

Bulk goods or tray

Downloads

Drawings

Further Information

Product Data Sheet

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