- back
- Description
- Technical Specifications
- Derating Diagram
- Matching Products
- Modifications
- Packaging
- Downloads
- Stock Check
One27 Male mid-profile Part No. 403-53012-51
Illustration similar
Parallel
Perpendicular
SMT
Cable-to-Board
High Density
Rugged
- 12 pins
- unmated stacking height: 3.25 mm
- for board-to-board distances from 9.5 to 18.4 mm
- SMT
- pitch 1.27 mm
- Performance level 1
Drawings
Further Information
Delivery time
Technical Specifications
Basics
No. of Contacts | 12 |
---|---|
Termination Technology | SMT |
Board-to-Board Distance | 9.5 mm to 18.4 mm |
Operating Temperature Range | -55°C to + 125°C |
Material
Insulator Material | LCP, UL 94 V-0 |
---|---|
CTI value IEC 60112 | 175 |
Contact Material | Copper alloy |
Plating | Au over PdNi over Ni |
Termination area | Sn over Ni |
Mechanical
Pitch | 1.27 mm |
---|---|
Mating Force per Pin | ≤ 0.5 N |
Separating Force per Pin | ≥ 0.1 N |
Durability IEC 60512-9-1 | Performance level 1: 500 mating cycles |
Coplanarity | ≤ 0.1 mm |
Vibration, sinusoidal IEC 60512-6-4 | 10 - 2000 Hz, 20g |
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5 | ≤ 1 µs |
Shock, semi-sinusoidal IEC 60512-6-3 | 50g, 11 ms |
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5 | ≤ 1 µs |
Electrical
Operational Current IEC 60512-5-2 | 1.4 A at 20°C (50 pins) |
---|---|
Contact Resistance IEC 60512-2-1 | ≤ 25 mΩ |
Clearance and Creepage | min. 0.4 mm |
Insulation Resistance IEC 60512-3-1 | ≥ 10 GΩ |
Test Voltage IEC 60512-4-1 | 500 VAC |
Processing
Soldering Temperature JEDEC J-STD-020E | 20 - 40 s at 260°C |
---|---|
MSL JEDEC J-STD-020E | 1 |
Assembly | Pick and Place |
Approval / Compliance
UL file | E130314 |
---|---|
Environment | RoHS compliant |
Matching Products
Modifications
Available on request
- different number of pins
- other performance level
Packaging
Tape and Reel
280 Stk / Reel