DIN 41612 VME 64x header Part No. 306-62067-12
Illustration similar
Perpendicular
Press-fit
Rugged
- Connector length: 4.6 mm
- Number of poles: 160
- Press-fit technology
- Grade 1
- ANSI flange
Technical Specifications
Basics
| Specification | IEC 61076-4-113 |
|---|---|
| Performance Level | 1 |
| No. of Contacts | 160 |
| Termination Technology | Press-fit technology |
| Termination Length | 4.6 mm |
| Operating Temperature Range | -55°C to +125°C |
Material
| Insulator Material | Glass-fiber-reinforced PBT, UL 94 V-0 |
|---|---|
| CTI value IEC 60112 | 200 |
| Contact Material | copper alloy |
Mechanical
| Pitch | 2.54 mm |
|---|---|
| Mating Force | 160 N |
| Separating Force per Pin | > 0.15 N |
| Durability | 500 insertion cycles |
Electrical
| Operational Current | 1.5 A |
|---|---|
| Contact Resistance | 20 mΩ |
| Clearance and Creepage | abc ≥ 1.2 mm, zd ≥ 1.0 mm |
| Insulation Resistance | 104 MΩ |
| Test Voltage | 1000 V |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Hole Specifications
| Material | chem. Sn Leiterplatten |
|---|---|
| Nennloch | Ø 1.0 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 1.0 +0.09 / -0.06 mm |
| C Grundbohrung | 1.15 ±0.025 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | chem. Sn Schicht, max. 1.5 µm |
| F Restring | min. 0.1 mm |
| Material | Ni, Au Leiterplatten |
|---|---|
| Nennloch | Ø 1.0 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 1.0 +0.09 / -0.06 mm |
| C Grundbohrung | 1.15 ±0.025 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | Ni, Au Schicht, 0.05 - 0.2 µm Au über 2.5 - 5 µm Ni |
| F Restring | min. 0.1 mm |
| Material | rein Cu Leiterplatten |
|---|---|
| Nennloch | Ø 1.0 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 1.0 +0.09 / -0.06 mm |
| C Grundbohrung | 1.15 ±0.025 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | OSP, z.B. GLICOAT-SMD (F2) mit 0.12 - 0.15 µm |
| F Restring | min. 0.1 mm |
| Material | HAL Sn Leiterplatten |
|---|---|
| Nennloch | Ø 1.0 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 1.0 +0.09 / -0.06 mm |
| C Grundbohrung | 1.15 ±0.025 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | HAL Sn, 5 - 15 µm |
| F Restring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Processing
Packaging
Tube
17 pieces per tube
12 tubes per box