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hm2.0 Terminal Block, Type M Part No. 243-41010-15
Illustration similar
Perpendicular
Press-fit
Power
- Number of poles: 55
- Connector length: 3.7 mm
- for PCB thickness > 2.2 mm
- Tested in accordance with IEC 61076-4-101
Technical Specifications
Basics
| Specification | IEC 61076-4-101 |
|---|---|
| Performance Level | 2 |
| No. of Contacts | 55 |
| Termination Technology | Press-fit technology |
| Termination Length | 3.7 mm |
| Operating Temperature Range | -55°C to +125°C |
Material
| Insulator Material | Glass-fiber-reinforced PBT, UL 94 V-0 |
|---|---|
| CTI value IEC 60112 | 200 |
| Contact Material | Bronze |
Mechanical
| Pitch | 2.0 mm |
|---|---|
| Mating Force per Pin | Contact: max. 0.75 N, Shielding: max. 1 N |
| Separating Force per Pin | Contact: min. 0.15 N, Shielding: min. 0.15 N |
| Durability | > 250 insertion cycles |
Electrical
| Operational Current | 1.5 A at +20°C, 1.0 A at +70°C |
|---|---|
| Contact Resistance | max. 20 mΩ |
| Clearance and Creepage | ≥ 0.8 mm |
| Insulation Resistance | at least 104 MΩ |
| Test Voltage | 750 V r.m.s. |
| Data Transfer Rate | 3.125 Gbit/s |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Hole Specifications
| Material | chem. Sn Schicht |
|---|---|
| Nennloch | Ø 0.6 mm |
| A Leiterplattendicke | min. 2.2 mm |
| B Endloch | Ø 0.60 ±0.05 mm |
| C Grundbohrung | 0.70 ±0.02 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | max. 1.5 µm; chem. Sn Leiterplatten |
| F Restring | min. 0.1 mm |
| Material | Ni, Au Leiterplatten |
|---|---|
| Nennloch | Ø 0.6 mm |
| A Leiterplattendicke | min. 2.2 mm |
| B Endloch | Ø 0.60 ±0.05 mm |
| C Grundbohrung | 0.70 ±0.02 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | Ni, Au Schicht, 0.05 - 0.2 µm Au über 2.5 - 5 µm Ni |
| F Restring | min. 0.1 mm |
| Material | rein Cu Leiterplatten |
|---|---|
| Nennloch | Ø 0.6 mm |
| A Leiterplattendicke | min. 2.2 mm |
| B Endloch | Ø 0.60 ±0.05 mm |
| C Grundbohrung | 0.70 ±0.02 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | OSP*,z.B. GLICOAT-SMD (F2) mit 0.12 - 0.15 µm |
| F Restring | min. 0.1 mm |
| Material | HAL Sn Leiterplatten |
|---|---|
| Nennloch | Ø 0.6 mm |
| A Leiterplattendicke | min. 2.2 mm |
| B Endloch | Ø 0.60 ±0.05 mm |
| C Grundbohrung | 0.70 ±0.02 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | HAL Sn, 5 - 15 µm |
| F Restring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Matching Products
Accessories
Modifications
Available on request
- Special configuration
- Other contact coatings
Processing
Packaging
Tube
10 pieces per tube
24 tubes per box