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DIN 41612 Female 90°, type R/2 Part No. 116-69064
Illustration similar
Perpendicular
Horizontal
Press-fit
Rugged
- Termination length 3 mm
- 48 contacts
- Press-fit
- performance level 2
Technical Specifications
Basics
| Specification | IEC 60603-2 (DIN 41612) |
|---|---|
| Performance Level | 2 |
| No. of Contacts | 48 |
| Termination Technology | Press-fit |
| Termination Length | 3 mm |
| Operating Temperature Range | -55°C to +125°C |
Material
| Insulator Material | PBT glass filled UL 94 V-0 |
|---|---|
| CTI value IEC 60112 | 200 |
| Contact Material | Copper alloy |
Mechanical
| Pitch | 2.54 mm |
|---|---|
| Mating Force | < 45 N |
| Separating Force per Pin | > 0.15 N |
| Durability | 400 mating cycles |
Electrical
| Operational Current | 1.5 A |
|---|---|
| Contact Resistance | <20 mΩ |
| Clearance and Creepage | ≥ 1.2 mm |
| Insulation Resistance | >106 MΩ |
| Test Voltage | 1000 V |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Derating Diagram
Hole Specifications
| Material | imm. Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | imm. Sn plating, max. 1.5 µm |
| F Annular Ring | min. 0.1 mm |
| Material | Ni, Au printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
| F Annular Ring | min. 0.1 mm |
| Material | pure Cu printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | OSP*, z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm |
| F Annular Ring | min. 0.1 mm |
| Material | HAL Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | HAL Sn, 5 - 15 µm |
| F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Modifications
Available on request
- Contact arrangement
- Performance levels I + III or customer-specific
- Special contact length
Processing
Packaging
Tray
54 pcs / Tray
10 Tray / Box